SECO and Libelium

SECO and Libelium join forces in the sensor space

An industrial partnership to increase the scale of data analysable by Clea in Smart cities, Smart infrastructures applications
Dirk Finstel

Dirk Finstel appointed as the new CEO of SECO Northern Europe GmbH

Dirk Finstel is the new Managing Director and CEO of SECO Northern Europe GmbH, succeeding Stefan Heczko, who has held the position since 2020 and will continue to serve as member of the advisory board. With Dirk Finstel, a long-standing industry expert could be attracted for the Northern European business of SECO.

SECO launches PHOENIX and PYXIS, two new fanless computer solutions

SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel® high-performance microprocessor platforms. Today, the company is launching two new fanless embedded computers for commercial and industrial environments.
Interaction between humans and machines

SECO Northern Europe gives an overview of current HMI trends and future developments

Whether in vending machine operation, machine control or medical equipment - haptic controls and analogue displays are increasingly being replaced by modern Human Machine Interfaces (HMIs) for interaction between people and machines.
Payment system with Visa- and Mastercard

Contactless payment with SECO's KarL4 now available with MasterCard and Visa

SECO has expanded the functionality of its KarL4 payment system. This means that contactless payment at terminals and machines enabled with KarL4 will soon be possible also with MasterCard and Visa in European countries outside Germany. Approval for the use of these credit cards with KarL4 is planned for the end of June.
Trizeps VIII Plus with Windows 10 IoT

Computer-on-Modules with Arm-architecture now available with Windows 10 IoT Enterprise

First SECO Arm-based Computer-on-Modules (COMs) with Windows 10 IoT Enterprise available.
Standard form factor solutions

SECO to launch two off-the-shelf computing solutions based on 11th Gen Intel® Core™ processors

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions - a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).
CHAMALEON Boxed-Solution

SECO launches a IP65 Boxed PC CHAMALEON based on Intel® ATOM® X5 ( formerly Apollo Lake) application processor

SECO enhances its family of fanless embedded computers with CHAMALEON, a boxed IP65 solution providing an excellent balance between computing and graphics performance, together with low power consumption.
Clea IoT Plattform

Deep dive: Clea-based demos showcased at embedded world

At this year’s edition of embedded world Exhibition&Conference, in Nuremberg, Germany, from June 21 to 23, SECO will showcase its expertise in delivering cutting-edge technology solutions, from miniaturized computers to fully customized integrated systems combining hardware and software, to artificial intelligence (AI) solutions.

SECO launches Rockchip-Based fanless IP20 boxed PC for high-end industrial applications

SECO adds to its family of Smart Edge boxed solutions with DORADO, a fanless, IP20 box PC based on the Rockchip RK3399 applications processor specifically designed for high-end industrial applications.