SECO: Discover Qseven®: The Ideal Low-Power COM for IoT Innovations

What is Qseven? Qseven Ecosystem Featured Modules

What is Qseven?

Qseven® is a computer-on-module (COM) form factor notable for its small size and low power consumption. The Qseven standard was first developed in 2008 by a consortium of embedded technology companies, including SECO, and has been hosted by SGET since 2013.

The Qseven standard supports Arm or x86 processor architectures, utilizes a single 230-pin MXM connector, and specifies a maximum power consumption of 12 watts. There are two module sizes available: the standard 70x70 mm, and the 40x70mm µQseven, for very low-power CPUs.

Small footprint

One of the smallest standard form factor modules at 70x70 mm or 40x70 mm, and slimmer than COM Express or SMARC modules.

Low power consumption

Max power consumption of 12 W for Qseven and less for µQseven, making it useful for mobile applications.

Arm or x86

Supports a variety of processor architectures including Intel Atom, Pentium, and Celeron.

Qseven Ecosystem

SECO's Qseven ecosystem includes off-the-shelf modules, accompanying OS, and Qseven development kits including module and carrier board. All of our Qseven products support compatibility with our IoT software suite Clea.

Featured Qseven Modules

SOM-uQ7-MX8M-Mini-Nano

μQseven® Computer on Module (CoM) with NXP i.MX 8M Mini & NXP i.MX 8M Nano Processors. (ELECTRA - C72)

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SOM-Q7-EHL

Qseven® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series SoCs (Codename: Elkhart Lake). (ATLAS - D62)

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SOM-uQ7-MX6-2

μQseven® Computer on Module (CoM) with NXP i.MX 6 Processors (NEMBUS - A75)

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View all Qseven modules

Qseven Modules by Processor

Intel NXP

Carrier Board Design

To incorporate into an electronic product, a Qseven module must be mounted to a carrier board, which is usually designed with application-specific interfaces and mechanicals. SECO offers comprehensive design services for custom carrier boards, letting you accelerate time-to-market by leveraging our expertise. We collaborate with you to define your product’s requirements and develop a product-specific carrier board with accompanying board support package (BSP). The latest high speed interface standards require added diligence to selecting an appropriate printed circuit board (PCB) stackup, accommodating tight routing strategies, and then utilizing expensive lab equipment for rigorous verification. Leveraging SECO minimizes carrier board design risk and smooths the development process.

Product Design and Manufacturing

Once the design process is complete, we manufacture and deliver your product-specific carrier board, with the COM Express module mounted and software configured with your image.

Beyond carrier boards, SECO designs and builds complete products including HMIs, boxed solutions, and rugged portable/handheld devices, available off-the-shelf or customized.

Qseven vs. SMARC

When choosing a form factor for a low power or space-constrained application, SMARC and Qseven are often the most appropriate options. SMARC is a newer standard that offers more functionality in a similar physical footprint as Qseven. SMARC supports 2x camera interfaces, while Qseven does not support MIPI CSI (it would support an Ethernet- or USB-based camera).

Qseven supports a smaller number of interfaces than SMARC, while SMARC enables more peripherals than Qseven does. While both standards use widely available connectors, the MXM2 connector used on Qseven modules is older and less commonly used than the MXM3 connector used in the SMARC standard.

Qseven modules are commonly used in low-power embedded applications such as: