When building resource-constrained avionics equipment - such as Unmanned Aerial Vehicles (UAVs), drones, and payload control systems - SWaP-C (size, weight, power, and cost) optimization is a critical factor in meeting mission-critical performance requirements. That’s why DoD initiatives such as MOSA (Modular Open Systems Approach) aim to support SWaP-C optimization through greater system affordability, interoperability, and adaptability in military applications.
To align with these requirements, many defense and avionics systems use backplane-based architectures like CompactPCI, MicroTCA, or OpenVPX embedded computing standards. But these architectures present a direct challenge to SWaP-C optimization due to their inherent form-factor constraints.
SECO solves these challenges with its SMARC (Smart Mobility Architecture) and COM Express products, based on open-standard computer-on-module (COM) specifications.
Optimizing SWaP-C with Computer-On-Modules
SMARC and COM Express use a card-like modular framework that aligns with the MOSA design strategy. The modular framework overcomes the heavy chassis, strict backplane, and bulky connectors of OpenVPX, CompactPCI, and MicroTCA specifications that hinder SWaP-C optimization.
Instead, SMARC and COM Express use a combination of commercial off-the-shelf (COTS) modules and application-specific carrier boards to support compact, lightweight, and power-efficient computing. Since these modules only require carrier board development for system integration, development costs and time-to-market are significantly reduced.
SMARC and COM Express specifications are not locked into a single vendor, meaning that future design iterations can easily swap out end-of-life computing modules for the latest version, without carrier board redesign. This standards-based approach promotes scalability and long equipment lifetime for cost and resource optimization.
SMARC Modules for Space-Constrained Systems
SMARC is a small-form-factor computer-on-module standard developed by the Standardization Group for Embedded Technologies (SGET). It is designed to meet the demands of resource-constrained embedded systems that require low power consumption, low cost, and high performance. SMARC presents a versatile computing platform for Arm and x86 processor technologies:
- Compact footprint: 82 mm x 50 mm for the ‘Short’ size format. This is significantly smaller and lighter than backplane system modules like 3U VPX cards, which measure 100 mm x 160 mm and are considerably thicker and heavier due to the rack faceplate and bulky backplane connectors.
- Easy mounting: SMARC modules interface with mating carrier boards via a 314-pin high-speed MXM3 connector.
- Standard interfaces: USB, PCIe, display, Ethernet, CAN, serial, and GPIO.
As a founding member of SGET, SECO is among the first to design and build SMARC modules like its high-performance, low-power SOM-SMARC-QCS6490. This solution is powered by the Qualcomm® Dragonwing™ QCS6490 processor, which integrates multiple Arm Cortex-A78 and Arm Cortex-A55 cores for demanding multiprocessing tasks like image analysis, while stabilizing flight and control systems (Figure 1). To support the high-performance demands of defense and avionics systems like UAVs, additional features include:
- Up to 12 GB of LPDDR5-6400 memory for managing large reconnaissance datasets
- Two MIPI CSI camera interfaces for high-speed video ingest
- CAN bus interface to support communications between onboard systems.
When combined with a custom carrier board, SMARC modules offer distinct advantages over backplane-based systems in terms of form factor, weight, and thermal design power (TDP). SMARC module design comprises:
- Compact form factor mounts flat onto the carrier board, making them ideal for space-constrained designs like UAVs.
- Lightweight build reduces weight by securely mounting without large metal rack and connector structures
- Fanless design: operates at high temperature with minimal passive cooling, increasing equipment uptime compared to active cooling systems.
The Superior Power of COM Express
COM Express is a set of computer-on-module specifications maintained by PICMG (PCI Industrial Computer Manufacturers Group), of which SECO is an active member. Like SMARC, COM Express supports Arm and x86 processing architectures, but its modules offer greater computing and interface capabilities to support higher-performance embedded applications.
For example, the SOM-COMe-BT6-ARL COM Express Rel. 3.1 Type 6 Basic Module is powered by Intel® Core™ Ultra Series Processors with multiple turbo-capable performance (P) and efficiency (E) cores. Built-in AI acceleration at up to 13 TOPS enables next-level analysis and decision making in mission-critical systems, combined with Intel’s Xe LPG Graphics
Architecture GPU for high-throughput computer vision. Two DDR5 SO-DIMM slots support up to 64 GB of DDR5-6400 memory for complex data analytics. Its 125 mm x 95 mm footprint is common across the COM Express ‘Basic’ size format—significantly smaller than the 100 mm x 160 mm 3U VPX card.
For an even smaller solution, SECO’s SOM-COMe-CT6-Snapdragon-X COM Express 3.1 Type 6 Compact module measures at 95 mm x 95 mm. Size does not sacrifice performance. Alongside the Snapdragon X processor and up to 64 GB of soldered LPDDR5 memory, a Qualcomm Hexagon NPU provides up to 45 TOPS for advanced AI processing. This makes the SOM-COMe-CT6-Snapdragon-X module well-suited for building intelligent autonomous systems where the size and weight of computing resources have previously been an issue.
Like SMARC, COM Express offers the same advantages of flat, secure mounting onto carrier boards, eliminating bulk and weight when compared to backplane-based architectures. While some system designs require active cooling due to increased processing requirements, many COM Express systems use passive cooling for greater TDP efficiency than backplane systems. When installed with proper conductive lubricants and other considerations, both SMARC and COM Express modules operate reliably through challenging mechanical shock and vibration environments.
Optimal Approaches for Unmanned System Design
For MOSA-aligned defense and avionics use cases like unmanned or uncrewed systems, SWaP-C is everything. Computer-on-modules, also known as system-on-modules (SOMs), offer a long lifecycle and a modular starting point for flexible designs that can be extended decades into the future. SECO is leading the way in this sector with its SMARC and COM Express modules that feature the latest processor technology to support cutting-edge mission requirements.
Learn more about SECO’s reliable, high-performance computer-on-module solutions and how the company is leading the way in SWaP-C optimization and MOSA-based design strategies to enter this rapidly-growing market of Defence & Avionics.