In an era where intelligent edge computing, AI-driven solutions, and Industrial IoT are transforming industries, the partnership between SECO and Qualcomm Technologies, Inc. stands as a catalyst for innovation. Bringing together SECO’s development expertise with Qualcomm Technologies industry leading technology, this collaboration sets new standards for industrial IoT applications.

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As a Qualcomm Technologies’ IIoT design center partner, SECO develops ready-to-use hardware solutions tailored for Industrial IoT, utilizing the latest IoT processors from Qualcomm®. These solutions integrate advanced connectivity, high-level AI acceleration, and scalable designs, ensuring optimal performance for critical industrial applications and Edge AI. SECO positions itself as a trusted partner in IIoT innovation by reducing development times and accelerating deployment. Its services help define solutions based on any Qualcomm platforms.

SECO continues to expand its Qualcomm-based product portfolio, offering a range of high-performance, energy-efficient embedded solutions that enable industrial customers to bring high-performance, AI-driven computing to the edge.

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For Single Board Computers (SBCs) & Custom Applications, SECO is actively developing SBCs based on the Dragonwing IQ-615 processor, enabling powerful and flexible embedded solutions for industrial HMIs, robotic controllers, smart vision, and intelligent edge applications.

SECO offers SMARC System-on-Modules (SoMs) featuring the Dragonwing QCS5430 and Dragonwing QCS6490 processors: the SOM-SMARC-QCS6490 and the SOM-SMARC-QCS5430. These SoMs provide scalable, high-performance solutions ideal for industrial HMI, industrial hand-held, machine vision, and AI-driven applications.

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SECO is developing a COM Express Computer-On-Module (COM) with Snapdragon X Series Platforms, offering top-tier computing power, AI acceleration, and high-efficiency processing with Windows support. The solution will be available across all Snapdragon X Elite, Snapdragon X Plus, and Snapdragon X Platforms, providing flexibility for a wide range of performance requirements.

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SECO is evaluating AI-optimized platforms utilizing Dragonwing IQ8 and IQ9 Series processors for AI Clea applications. These platforms will power advanced AI SBCs and AI Box solutions, enabling industrial customers to integrate real-time intelligence, edge computing, and machine learning capabilities into their operations.

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Be part of the future—visit SECO at hall 1, booth 320, and explore how SECO & Qualcomm are enabling businesses to harness the full potential of AI, IoT, and edge computing.

Embedded World booth