The two DIN-rail platforms combine industrial connectivity and local processing with Clea-enabled lifecycle management, addressing different requirements across industrial and energy edge deployments.
SECO, a high-tech company delivering integrated edge AI infrastructure and Physical AI systems, today announces that Modular Link IQ-615 and Modular Link MX93 have entered mass production and are now available to order. Designed for OEMs and system integrators deploying connected edge systems, the two compact DIN-rail platforms combine local processing capabilities with industrial connectivity and software enablement through the Clea ecosystem. Addressing different computing, expansion, and connectivity requirements, they provide flexible building blocks for industrial and energy applications where reliable edge data processing and long-term device management are key.
Two complementary platforms for connected industrial edge systems
Modular Link IQ-615 and Modular Link MX93 address complementary requirements at the industrial edge. Powered by the Qualcomm Dragonwing™ IQ6 Series platform (IQ-615), Modular Link IQ-615 is designed for connected infrastructures requiring local data processing and integrated AI capabilities alongside industrial connectivity. Its compact DIN-rail form factor makes it suitable for distributed applications including industrial IoT, automation, smart energy, and remote monitoring.
Built around the NXP i.MX 93 processor, Modular Link MX93 focuses on energy-efficient computing and flexibility through a modular architecture that can adapt to different connectivity and I/O requirements. Its stackable design allows the platform to be expanded through interchangeable daughter boards according to application needs, making it particularly suited to industrial automation, energy and utilities, building automation, and retrofit scenarios where requirements may evolve over time.
Key features of the two platforms include:
- Modular Link IQ-615: Qualcomm Dragonwing IQ6 Series platform (IQ-615) with an octa-core Qualcomm® Kryo™ 460 CPU; Qualcomm Hexagon AI acceleration delivering up to 1 TOPS; dual Ethernet, USB 3.1 and RS-485 connectivity; Wi-Fi and Bluetooth support; up to 4 GB LPDDR4 memory and 32 GB eMMC storage; and an industrial operating temperature range of -40°C to +80°C.
- Modular Link MX93: NXP i.MX 93 processor with integrated machine learning acceleration up to 0.5 TOPS; dual Gigabit Ethernet and wireless connectivity options; stackable expansion through daughter boards for additional connectivity and I/O configurations; up to 2 GB LPDDR4 memory and 32 GB eMMC storage; and an industrial operating temperature range of -40°C to +85°C.
Extending hardware capabilities with the Clea ecosystem
Integration with the Clea ecosystem, recently enhanced with the launch of Clea 2.0 Agentic Framework, extends the capabilities of both platforms beyond hardware, providing a common software foundation for managing connected devices throughout their lifecycle. From remote monitoring and device management to over-the-air software updates, Clea helps OEMs and system integrators operate distributed fleets more efficiently while maintaining control over devices as requirements evolve. By combining industrial-grade hardware and software within a unified ecosystem, SECO enables customers to move from edge deployment to long-term operation without adding unnecessary management complexity.
Francesco Vaiani, Product Manager Team Leader SOM & SYS at SECO, added:
“Industrial edge projects increasingly require more than processing power and connectivity alone. OEMs and system integrators need platforms that can adapt to different application requirements while remaining manageable throughout their lifecycle. With Modular Link IQ-615 and Modular Link MX93, we are combining complementary hardware capabilities with the Clea ecosystem to help customers build, deploy and manage connected edge infrastructures on a consistent foundation.”
Availability
For further details on specifications, configurations, and availability, visit the product pages for Modular Link IQ-615 and Modular Link MX93.