The SOM-COMe-CT6-R8000 combines multicore x86 computing, AMD RDNA 3 graphics, and dedicated NPU acceleration for demanding industrial Edge AI applications.
SECO, a high-tech company delivering integrated edge AI infrastructure and Physical AI systems, today announces that samples of the SOM-COMe-CT6-R8000, its COM Express® 3.1 Type 6 Compact module based on AMD Ryzen™ Embedded 8000 Series processors, are now available. Combining multicore x86 processing, integrated AMD RDNA 3 graphics and an embedded AMD XDNA Neural Processing Unit (NPU), the module is designed for demanding industrial edge applications requiring high-performance computing, advanced graphics and local AI acceleration.
Within its COM Express Type 6 Compact architecture, the SOM-COMe-CT6-R8000 offers the following key specifications:
- AMD Ryzen™ Embedded 8000 Series processor options across the HS and U families, with up to 8 cores and 16 threads
- Integrated AMD RDNA 3 graphics with up to 6 WGPs
- Embedded AMD XDNA Neural Processing Unit (NPU), capable of 16 TOPS of AI Performance, 39 TOPS when combined with CPU and GPU
- Two DDR5-5600 SO-DIMM slots
- PCIe Gen4 and high-speed USB connectivity
- Support for up to four independent displays
As industrial edge systems take on increasingly complex workloads, system designers need to combine general-purpose computing, advanced graphics, and AI processing while maintaining the flexibility to adapt platforms to different applications. By bringing CPU, GPU, and NPU capabilities together on a COM Express Type 6 Compact module, the SOM-COMe-CT6-R8000 enables processing and AI inference to run locally, supporting applications where responsiveness, efficient data processing, and system integration are key.
This combination makes the module well suited to use cases ranging from advanced HMIs and machine vision to industrial automation, intelligent control systems, robotics and Physical AI. Local AI acceleration can support vision and visual analysis workloads, while the integrated graphics capabilities address visualization and multi-display requirements.
Modularity for evolving industrial edge systems
The COM Express architecture allows these capabilities to be integrated into application-specific systems through a dedicated carrier board, giving OEMs the flexibility to tailor connectivity and system design to their deployment requirements. This modular approach provides a path to scale computing capabilities while retaining control over the overall system architecture. The SOM-COMe-CT6-R8000 further expands SECO’s COM Express portfolio with an AMD-based option designed to support evolving industrial edge requirements.
Francesco Vaiani, Product Manager Team Leader SOM & SYS at SECO, said:
“As AI becomes an integral part of more industrial applications, OEMs need computing platforms that can support increasingly demanding workloads without sacrificing the flexibility required to design around their specific use cases. With the SOM-COMe-CT6-R8000, we are expanding our COM Express offering with a platform that brings together x86 computing, graphics and dedicated AI acceleration, giving customers a scalable foundation for the next generation of intelligent edge systems.”
Extending edge capabilities through software and lifecycle management
Beyond computing performance, the SOM-COMe-CT6-R8000 supports Clea OS, SECO’s Yocto-based operating system designed for industrial edge devices. Within the broader Clea framework, capabilities including Secure Boot, OTA updates, device monitoring, and support for containerized applications help OEMs deploy and manage connected systems throughout their lifecycle. This integrated hardware and software approach supports application deployment, remote updates, and long-term device operations.
Further details, technical resources, and sample requests are available on the SOM-COMe-CT6-R8000 product page.