Standard form factor solutions

SECO to launch two off-the-shelf computing solutions based on 11th Gen Intel® Core™ processors

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions - a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).
CHAMALEON Boxed-Solution

SECO launches a IP65 Boxed PC CHAMALEON based on Intel® ATOM® X5 ( formerly Apollo Lake) application processor

SECO enhances its family of fanless embedded computers with CHAMALEON, a boxed IP65 solution providing an excellent balance between computing and graphics performance, together with low power consumption.
Clea IoT Plattform

Deep dive: Clea-based demos showcased at embedded world

At this year’s edition of embedded world Exhibition&Conference, in Nuremberg, Germany, from June 21 to 23, SECO will showcase its expertise in delivering cutting-edge technology solutions, from miniaturized computers to fully customized integrated systems combining hardware and software, to artificial intelligence (AI) solutions.
DORADO Boxed-PC

SECO launches Rockchip-Based fanless IP20 boxed PC for high-end industrial applications

SECO adds to its family of Smart Edge boxed solutions with DORADO, a fanless, IP20 box PC based on the Rockchip RK3399 applications processor specifically designed for high-end industrial applications.
HMI NALLINO 4.3''

SECO presents its expanded Human Machine Interface portfolio at embedded world 2022

Through the acquisition of the Garz & Fricke Group in 2021, SECO customers benefit from a unique and complete human machine interface (HMI) product portfolio. At this year's embedded world trade fair, SECO will present its modular product portfolio, which combines a wide variety of processors with sophisticated installation options.
Embedded World 2022

Discovering more about SECO product portfolio showcased at Embedded World 2022

From June 21 to 23, 2022, embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre.
Embedded World 2022

SECO presents its product & service portfolio at Embedded World 2022 - from Edge to AI

The leading international tradeshow for embedded system technology returns in-person; SECO prepares to meet with customers and partners
Camozzi and SECO

SECO and Camozzi Digital sign an industrial partnership to accelerate growth in the IIoT market

Over 90 ready-to-use apps, algorithms and smart connectors for the Industrial world developed by Camozzi Digital will be integrated into Clea, the IoT platform based on AI techniques developed by SECOCamozzi Digital will transfer a business unit and assets with a value of €50M, entering the share capital of SECO with a stake of 6.73% and becoming a reference shareholder with a long-term approachCamozzi Digital signs a multi-year contract for the purchase of Clea licenses for €3.6M; the purchase of SECO…
Edge Q7 STARTER KIT

SECO releases new Qseven® 2.1 Starter Kit and Carrier Board

The new Qseven® Cross Platform Starter Kit is based on a new ready-to-use Carrier Board and offers all the basic components for development with Qseven® compatible Computer on Modules (COM) Rev. 2.0 and 2.1.
Partnership Surveillance

Cybersecurity: Exein-Seco sign an industrial partnership

SECO SpA (“SECO”) and Exein SpA (“Exein”) announce the start of an industrial partnership to introduce, into SECO devices, a software solution specifically dedicated to cybersecurity and the strengthening of the protection and security levels of SECO’s edge-to-AI offering.